apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
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30167 Hannover
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Publikationsliste
Showing results 41 - 60 out of 107
2015
Impact of aluminium addition on the corrosion behaviour of Sn-1.0Ag-0.5Cu lead-free solder. / Nordin, N. I.M.; Said, S. M.; Ramli, R. et al.
In: RSC Advances, Vol. 5, No. 120, 2015, p. 99058-99064.Research output: Contribution to journal › Article › Research › peer review
Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys. / Sabri, M. F.M.; Nordin, N. I.M.; Said, S. M. et al.
In: Microelectronics reliability, Vol. 55, No. 9-10, 08.2015, p. 1882-1885.Research output: Contribution to journal › Article › Research › peer review
How SI/EMC and reliability issues could interact together in embedded electronic systems? / Weide-Zaage, Kirsten; Moujbani, Aymen; Duchamp, Genevieve et al.
2015 IEEE International Symposium on Electromagnetic Compatibility, EMC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 1323-1328 7256363 (IEEE International Symposium on Electromagnetic Compatibility; Vol. 2015-Septmber).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Life time characterization for a highly robust metallization. / Weide-Zaage, K.; Kludt; Ackermann, M. et al.
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7103123.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2014
Qualification procedure for moisture in embedded capacitors. / Frémont, Hélène; Kludt, Jörg; Wade, Massar et al.
In: Microelectronics reliability, Vol. 54, No. 9-10, 01.09.2014, p. 2013-2016.Research output: Contribution to journal › Article › Research › peer review
Evaluation new corner stress relief structure layout for high robust metallization. / Hein, V.; Kludt, J.; Weide-Zaage, K.
In: Microelectronics reliability, Vol. 54, No. 9-10, 01.09.2014, p. 1977-1981.Research output: Contribution to journal › Article › Research › peer review
Degradation behavior in upstream/downstream via test structures. / Kludt, J.; Weide-Zaage, K.; Ackermann, M. et al.
In: Microelectronics reliability, Vol. 54, No. 9-10, 01.09.2014, p. 1724-1728.Research output: Contribution to journal › Article › Research › peer review
Reliability performance of different layouts of wide metal tracks. / Kludt, Jorg; Weide-Zaage, Kirsten; Ackermann, Markus et al.
2014 IEEE International Reliability Physics Symposium, IRPS 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. IT.4.1-IT.4.4 6861153 (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Electromigration reliability of cylindrical Cu pillar SnAg 3.0Cu0.5 bumps. / Meinshausen, L.; Weide-Zaage, K.; Goldbeck, B. et al.
2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014. IEEE Computer Society, 2014. 6813775 (2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Reliability of wafer level chip scale packages. / Rongen, R.; Roucou, R.; Vd Wel, P. J. et al.
In: Microelectronics reliability, Vol. 54, No. 9-10, 01.09.2014, p. 1988-1994.Research output: Contribution to journal › Article › Research › peer review
Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core. / Weide-Zaage, K.; Schlobohm, J.; Rongen, R. T.H. et al.
In: Microelectronics reliability, Vol. 54, No. 6-7, 2014, p. 1206-1211.Research output: Contribution to journal › Article › Research › peer review
Simulation in 3D integration and TSV. / Weide-Zaage, K.; Moujbani, A.; Kludt, J.
2014 IEEE 5th Latin American Symposium on Circuits and Systems, LASCAS 2014 - Conference Proceedings. IEEE Computer Society, 2014. 6820324.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2013
Characterization of a new designed octahedron slotted metal track by simulations. / Kludt, Jörg; Weide-Zaage, K.; Ackermann, M. et al.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529907 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Deformation of octahedron slotted metal tracks. / Kludt, Jörg; Weide-Zaage, Kirsten; Ackermann, Markus et al.
2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., 2013. p. 161-165 6804184 (IEEE International Integrated Reliability Workshop Final Report).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Dynamic simulation of octahedron slotted metal structures. / Kludt, J.; Weide-Zaage, K.; Ackermann, M. et al.
In: Microelectronics reliability, Vol. 53, No. 9-11, 09.2013, p. 1606-1610.Research output: Contribution to journal › Article › Research › peer review
Investigation of temperature gradients with regard to thermomigration in aluminium metallizations. / Kludt, Jörg; Weide-Zaage, K.; Ackermann, M. et al.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529896 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Overlap design for higher tungsten via robustness in AlCu metallizations. / Kludt, Jorg; Weide-Zaage, Kirsten; Ackermann, Markus et al.
2013 IEEE International Integrated Reliability Workshop Final Report, IIRW 2013. Institute of Electrical and Electronics Engineers Inc., 2013. p. 137-141 6804178 (IEEE International Integrated Reliability Workshop Final Report).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads. / Meinshausen, L.; Frémont, H.; Weide-Zaage, K. et al.
In: Microelectronics reliability, Vol. 53, No. 9-11, 09.2013, p. 1575-1580.Research output: Contribution to journal › Article › Research › peer review
Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing. / Meinshausen, L.; Weide-Zaage, K.; Frémont, H.
2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013. 2013. 6529895 (2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Dynamic simulation of migration induced failure mechanism in integrated circuit interconnects. / Moujbani, Aymen; Kludt, Jörg; Weide-Zaage, Kirsten et al.
In: Microelectronics reliability, Vol. 53, No. 9-11, 09.2013, p. 1365-1369.Research output: Contribution to journal › Article › Research › peer review
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Forschungsprojekte
Systementwurf
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Simulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungSimulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.09.2013-31.01.2015
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Component reliability in high temperature automotive applications (Rely)Thermisch-elektrisch-mechanische Simulation, Degradationsmodellierung auf Device-LevelLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.05.2011-30.04.2013
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Untersuchung zur Simulation von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer SystemeIm Zuge der Miniaturisierung moderner integrierter Schaltungen verändert sich die Strahlenhärte der Systeme und Komponenten. Daraus resultierend ist es notwendig, die die Strahlenhärte beeinflussenden Mechanismen im Halbleiter zu bestimmen.Led by: PD Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2015Duration: 01.02.2015-31.12.2017
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Entwurf und Test von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer System unter Hochtemperatur-UmgebungenDie Eignung von Bauelementen und Komponenten für die Entwicklung strahlungsrobuster autonomer Systeme, die insbesondere mit einer langen Verweildauer in einer strahlenbelasteten Umgebung ihren Einsatz finden, hängt stark von der Dimensionierung sowie dem Herstellungsprozess der Bauelemente und Komponenten ab. Simulationen können helfen, die physikalischen Zusammenhänge besser zu verstehen. Im geplanten Projekt ist der Entwurf und Test von Halbleiterkomponenten unter erschwerten Umwelt-Bedingungen wie Strahlung und Temperatur geplant.Led by: apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2021Duration: 1.9.2019- 31.8.2022
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