Effect of thermal aging on the electrical resistivity of Fe-added SAC105 solder alloys

authored by

M. F.M. Sabri, N. I.M. Nordin, S. M. Said, N. A.A.M. Amin, H. Arof, I. Jauhari, R. Ramli, K. Weide-Zaage

Abstract

The ternary Sn-1.0Ag-0.5Cu (SAC105) solders doped with a minor addition of Fe (0.1, 0.3 and 0.5 wt.%) have been shown to demonstrate excellent mechanical thermal cyclic reliability. To complement the mechanical performance, the electrical resistivities of SAC105, SAC105-0.1Fe, SAC105-0.3Fe, and SAC105-0.5Fe bulk solder alloys were also characterised after thermal aging. Results showed that the overall resistivity decreased by up to 13% after the thermal aging process. Meanwhile the electrical resistivity for 0.1 wt.%, 0.3 wt.%, and 0.5 wt.% Fe-bearing SAC105 solder alloys decreased by 25%, 11%, and 17% respectively, showing a rather stable reduction in resistivity. This can be correlated to the stabilisation of the microstructure of the Fe-added SAC 105 after thermal aging.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

University of Malaya (UM)

Type

Article

Journal

Microelectronics reliability

Volume

55

Pages

1882-1885

No. of pages

4

ISSN

0026-2714

Publication date

08.2015

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/j.microrel.2015.06.123 (Access: Closed)