apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
30167 Hannover
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Publikationsliste
Showing results 81 - 100 out of 107
2008
Comprehensive reliability analysis of CoWP metal Cap unit processes for high volume production in sub-μm dimensions. / Aubel, O.; Thierbach, S.; Seidel, R. et al.
46th Annual 2008 IEEE International Reliability Physics Symposium Proceedings, IRPS. 2008. p. 675-676 4558983 (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Determination of migration effects in Cu-via structures with respect to process-induced stress. / Weide-Zaage, Kirsten; Zhao, Jiani; Ciptokusumo, Joharsyah et al.
In: Microelectronics reliability, Vol. 48, No. 8-9, 08.2008, p. 1393-1397.Research output: Contribution to journal › Article › Research › peer review
Simulation of migration effects in nanoscaled copper metallizations. / Weide-Zaage, Kirsten; Kashanchi, Farzan; Aubel, Oliver.
In: Microelectronics reliability, Vol. 48, No. 8-9, 08.2008, p. 1398-1402.Research output: Contribution to journal › Article › Research › peer review
Simulation of migration effects in PoP. / Weide-Zaage, Kirsten; Fremont, Helene; Wang, Linyan.
EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems. 2008. 4525074 (EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulation of migration effects in solder bumps. / Weide-Zaage, Kirsten.
In: IEEE Transactions on Device and Materials Reliability, Vol. 8, No. 3, 4595633, 09.2008, p. 442-448.Research output: Contribution to journal › Article › Research › peer review
2007
Dynamic void formation in a DD-copper-structure with different metallization geometry. / Weide-Zaage, Kirsten; Dalleau, David; Danto, Yves et al.
In: Microelectronics reliability, Vol. 47, No. 2-3, 02.2007, p. 319-325.Research output: Contribution to journal › Article › Research › peer review
2006
Measurements and FE-simulations of moisture distribution in FR4 based printed circuit boards. / Frémont, Hélène; Horaud, Walter; Weide-Zaage, Kirsten.
7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. 2006. 1643964 (7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006; Vol. 2006).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2005
Moisture diffusion in printed circuit boards: Measurements and finite- element- simulations. / Weide-Zaage, Kirsten; Horaud, Walter; Frémont, Hélène.
In: Microelectronics reliability, Vol. 45, No. 9-11, 09.2005, p. 1662-1667.Research output: Contribution to journal › Article › Research › peer review
Simulation of mass flux divergence distributions for an evaluation of commercial test structures with tungsten-plugs. / Weide-Zaage, Kirsten; Hein, Verena.
Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005. 2005. p. 353-358 1502827 (Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems - EuroSimE 2005; Vol. 2005).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2004
How to study delamination in plastic encapsulated devices. / Frémont, Hélène; Delétage, Jean Yves; Weide-Zaage, Kirsten et al.
In: Microelectronics reliability, Vol. 44, No. 9-11 SPEC. ISS., 09.2004, p. 1311-1316.Research output: Contribution to journal › Article › Research › peer review
Effect of thermal gradients on the electromigration life-time in power electronics. / Nguyen, H. V.; Salm, C.; Krabbenborg, B. et al.
2004 IEEE International Reliability Physics Symposium: Proceedings. Vol. 2004-January January. ed. 2004. p. 619-620 (IEEE International Reliability Physics Symposium Proceedings).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Effect of thermal gradients on the electromigration lifetime in power electronics. / Nguyen, H. V.; Salm, C.; Krabbenborg, B. et al.
2004 IEEE International Reliability Physics Symposium. Proceedings. 2004. p. 619-620 (Annual Proceedings - Reliability Physics (Symposium)).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry. / Weide-Zaage, Kirsten; Dalleau, David; Danto, Yves et al.
Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004. ed. / L.J. Ernst; G.Q. Zhang; P. Rodgers; O. Saint Leger. 2004. p. 367-372 (Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2003
Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures. / Dalleau, David; Weide-Zaage, Kirsten; Danto, Yves.
In: Microelectronics reliability, Vol. 43, No. 9-11, 09.2003, p. 1821-1826.Research output: Contribution to journal › Conference article › Research › peer review
Static and dynamic analysis of failure locations and void formation in interconnects due to various migration mechanisms. / Weide-Zaage, Kirsten; Dalleau, David; Yu, Xiaoying.
In: Materials Science in Semiconductor Processing, Vol. 6, No. 1-3, 02.2003, p. 85-92.Research output: Contribution to journal › Article › Research › peer review
2001
Three-dimensional voids simulation in chip metallization structures: A contribution to reliability evaluation. / Dalleau, D.; Weide-Zaage, K.
In: Microelectronics reliability, Vol. 41, No. 9-10, 09.2001, p. 1625-1630.Research output: Contribution to journal › Article › Research › peer review
Verifikation der layout getreuen FE-simulation eines MO-166 gehäuses mittels elektrischer messung und IR-untersuchung. / Weide-Zaage, K.; Keck, C.; Willemen, J.
In: ITG-Fachbericht, No. 164, 2001, p. 219.Research output: Contribution to journal › Conference article › Research › peer review
Vergleich industrieller entwicklungswerkzeuge für elektrothermische schaltungssimulation. / Willemen, J.; Soppa, W.; Pieper, K. W. et al.
In: ITG-Fachbericht, No. 164, 2001, p. 143.Research output: Contribution to journal › Conference article › Research › peer review
2000
3-D time-depending electro- and thermomigration simulation of metallization structures. / Dalleau, D.; Weide-Zaage, K.
In: Advanced Metallization Conference (AMC), 2000, p. 477-481.Research output: Contribution to journal › Conference article › Research › peer review
1999
Impact of FEM simulation on reliability improvement of packaging. / Weide, Kirsten.
In: Microelectronics reliability, Vol. 39, No. 6-7, 1999, p. 1079-1088.Research output: Contribution to journal › Conference article › Research › peer review
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Forschungsprojekte
Systementwurf
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Simulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungSimulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.09.2013-31.01.2015
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Component reliability in high temperature automotive applications (Rely)Thermisch-elektrisch-mechanische Simulation, Degradationsmodellierung auf Device-LevelLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.05.2011-30.04.2013
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Untersuchung zur Simulation von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer SystemeIm Zuge der Miniaturisierung moderner integrierter Schaltungen verändert sich die Strahlenhärte der Systeme und Komponenten. Daraus resultierend ist es notwendig, die die Strahlenhärte beeinflussenden Mechanismen im Halbleiter zu bestimmen.Led by: PD Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2015Duration: 01.02.2015-31.12.2017
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Entwurf und Test von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer System unter Hochtemperatur-UmgebungenDie Eignung von Bauelementen und Komponenten für die Entwicklung strahlungsrobuster autonomer Systeme, die insbesondere mit einer langen Verweildauer in einer strahlenbelasteten Umgebung ihren Einsatz finden, hängt stark von der Dimensionierung sowie dem Herstellungsprozess der Bauelemente und Komponenten ab. Simulationen können helfen, die physikalischen Zusammenhänge besser zu verstehen. Im geplanten Projekt ist der Entwurf und Test von Halbleiterkomponenten unter erschwerten Umwelt-Bedingungen wie Strahlung und Temperatur geplant.Led by: apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2021Duration: 1.9.2019- 31.8.2022
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