apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-Zaage
30167 Hannover
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Publikationsliste
Showing results 1 - 20 out of 107
2024
The Comparison of the Reliability Performance of Different Top Metal Materials in MEMS Applications. / Hein, Verena; Weide-Zaage, Kirsten; Clausner, Andre.
2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 2024.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Characterization of Soft Errors on a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. / Trumann, Eike; Thieu, Gia Bao; Schmechel, Johannes et al.
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 2024.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Dna Digital-storage: Advantages, Approach and Technical Implementation. / Weide-Zaage, Kirsten.
2024 Pan Pacific Strategic Electronics Symposium: Pan Pacific. Institute of Electrical and Electronics Engineers Inc., 2024.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulation of Different SRAM Cells under Neutron Radiation with GEANT4. / Weide-Zaage, Kirsten; Mandala, Satria Jaya; Trumann, Eike et al.
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 2024.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulation of Thermal–Electrical and Mechanical Behavior of Conductive Yarns. / Weide-Zaage, Kirsten; Huang, Yuankai.
In: Engineering Proceedings, Vol. 52, No. 1, 17, 18.01.2024.Research output: Contribution to journal › Article › Research › peer review
Technical Implementation of DNA Data-Storage. / Weide-Zaage, Kirsten.
2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers Inc., 2024. p. 111-112.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2023
A Probability Soft-Error Model for a 28-nm SRAM-based FPGA under Neutron Radiation Exposure. / Thieu, Gia Bao; Schmechel, Johannes; Weide-Zaage, Kirsten et al.
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems: EuroSimE . Institute of Electrical and Electronics Engineers Inc., 2023. ( International Conference on Thermal, Mechanical and Multi-physics Simulation and Experiments in Microelectronics and Microsystems).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Radiation Tolerant Reconfigurable Hardware Architecture Design Methodology. / Trumann, Eike; Thieu, Gia Bao; Schmechel, Johannes et al.
Applied Reconfigurable Computing. Architectures, Tools, and Applications: 19th International Symposium, ARC 2023, Proceedings. ed. / Francesca Palumbo; Georgios Keramidas; Nikolaos Voros; Pedro C. Diniz. Springer Science and Business Media Deutschland GmbH, 2023. p. 357-360 (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Vol. 14251 LNCS).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2022
Developing a micro-thermography system for thermal characterization of LED packages. / Hollstein, K.; Entholzner, D.; Zhu, G. et al.
In: Microelectronic engineering, Vol. 254, 111694, 01.02.2022.Research output: Contribution to journal › Article › Research › peer review
Investigation of FPGA and SRAM Cells under Radiation Exposure. / Weide-Zaage, Kirsten; Paya-Vaya, Guillermo; Schmidt, Katharina et al.
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022. Institute of Electrical and Electronics Engineers Inc., 2022. (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2022).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2021
The Improvement of the Life Time Performance Estimation for Interconnect Stacks in Realistic Layouts. / Hein, Verena; Weide-Zaage, Kirsten.
2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021. Institute of Electrical and Electronics Engineers Inc., 2021. 9410880 (2021 22nd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2021).Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach. / Hollstein, K.; Yang, X.; Weide-Zaage, K.
In: Microelectronics reliability, Vol. 120, 114118, 05.2021.Research output: Contribution to journal › Article › Research › peer review
2020
Advances in Packaging for Emerging Technologies. / Hollstein, Kai; Weide-Zaage, Kirsten.
2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9059539.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Identification of influencing PCB design parameters on thermal performance of a QFN package. / Hollstein, Kai; Yang, Lintao; Gao, Yuan et al.
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9152651.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Silicon Die Bonding using a Photostructurable Adhesive Material. / Hollstein, Kai; Weide-Zaage, Kirsten.
2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9375868.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2019
Layout optimization of CMOS interconnects for heating, cooling and improved stress distribution. / Hein, Verena; Weide-Zaage, Kirsten; Yang, Xi.
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724562.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Electromigration effects in corroded BGA. / Weide-Zaage, Kirsten; Guedon-Gracia, Alexandrine; Fremont, Helene.
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724522.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
New-Automotive -Autonomous Driving Challenges For The Microelectronic Components. / Weide-Zaage, Kirsten.
2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8696273.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Simulations in terms of radiation effects on different BEOL material systems. / Weide-Zaage, Kirsten; Paya-Vaya, Guillermo; Eichin, Philemon.
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724581.Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2018
Electromigration and morphological changes in Ag nanostructures. / Chatterjee, Atasi; Bai, Tianjin; Edler, Frederik et al.
In: Journal of Physics Condensed Matter, Vol. 30, No. 8, 084002, 31.01.2018.Research output: Contribution to journal › Article › Research › peer review
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Forschungsprojekte
Systementwurf
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Simulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungSimulation von elektronischen Bauelementen und Komponenten unter Einfluss von StrahlungLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.09.2013-31.01.2015
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Component reliability in high temperature automotive applications (Rely)Thermisch-elektrisch-mechanische Simulation, Degradationsmodellierung auf Device-LevelLed by: PD Dr.-Ing. Dipl.-Phys. K. Weide-ZaageTeam:Year: 2014Duration: 01.05.2011-30.04.2013
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Untersuchung zur Simulation von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer SystemeIm Zuge der Miniaturisierung moderner integrierter Schaltungen verändert sich die Strahlenhärte der Systeme und Komponenten. Daraus resultierend ist es notwendig, die die Strahlenhärte beeinflussenden Mechanismen im Halbleiter zu bestimmen.Led by: PD Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2015Duration: 01.02.2015-31.12.2017
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Entwurf und Test von Bauelementen und Komponenten für die Entwicklung strahlenrobuster autonomer System unter Hochtemperatur-UmgebungenDie Eignung von Bauelementen und Komponenten für die Entwicklung strahlungsrobuster autonomer Systeme, die insbesondere mit einer langen Verweildauer in einer strahlenbelasteten Umgebung ihren Einsatz finden, hängt stark von der Dimensionierung sowie dem Herstellungsprozess der Bauelemente und Komponenten ab. Simulationen können helfen, die physikalischen Zusammenhänge besser zu verstehen. Im geplanten Projekt ist der Entwurf und Test von Halbleiterkomponenten unter erschwerten Umwelt-Bedingungen wie Strahlung und Temperatur geplant.Led by: apl. Prof. Dr.-Ing. Dipl.-Phys. Kirsten Weide-ZaageYear: 2021Duration: 1.9.2019- 31.8.2022
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