Electro- and thermomigration-induced IMC formation in SnAg 3.0Cu0.5 solder joints on nickel gold pads
- authored by
- L. Meinshausen, H. Frémont, K. Weide-Zaage, B. Plano
- Abstract
The progress in three dimensional packaging leads to smaller solder joints. A growing part of their volume consists of IMCs (intermetallic compounds). The IMCs are formed through migration processes during the soldering. These phenomena continue during use of the component. As a consequence micro bumps (ø < 30 μm) completely consist of intermetallic compounds. Intermetallic compounds also enable electromigration induced void formation at the contacts surfaces of flip chip solder joints. It is essential for the fabrication of micro bumps and for the investigation of failure mechanisms in flip chip solder joints to characterize the migration-induced IMC formation. This study is based on the combination of electromigration, thermomigration and temperature storage tests on SnAg3.0Cu0.5 solder joints with NiAu pads. For the investigation of migration processes due to temperature gradients (thermomigration), alternating current tests for solder joints were developed. Finally, more accurate material parameters for the description of the migration-induced intermetallic compound formation are extracted, namely the activation energy (EA), the diffusion constant (D0), the effective charge of the moving ions (Z*) and the heat of transport (Q*).
- Organisation(s)
-
Laboratorium f. Informationstechnologie
- External Organisation(s)
-
Universite de Bordeaux
- Type
- Article
- Journal
- Microelectronics reliability
- Volume
- 53
- Pages
- 1575-1580
- No. of pages
- 6
- ISSN
- 0026-2714
- Publication date
- 09.2013
- Publication status
- Published
- Peer reviewed
- Yes
- ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering
- Electronic version(s)
-
https://doi.org/10.1016/j.microrel.2013.07.038 (Access:
Unknown)
