Evaluation new corner stress relief structure layout for high robust metallization

authored by

V. Hein, J. Kludt, K. Weide-Zaage

Abstract

For a high robust metallization it is necessary to solve different problems related to migration mechanisms and thermo-mechanical stress in the material. Extended operating conditions and challenging assembling processes influence stress behaviour in chip corners. Typically the corner area of the chip is excluded for use. For higher stress load the forbidden area increases. But effort for demanding mission profiles of a product should not cumulative in increasing chip size. Simulation can help to a better understanding of mechanical stress in the chip corner and chip-package interaction. Corner stress relief structures lower the influence of high thermo-mechanical stress. A high functional corner stress relief structure allows a more efficient chip design. In this work of corner stress relief structure is presented and an evaluation structure is shown which allows to prove the effectiveness of the stress relief.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

X-FAB Silicon Foundries SE

Type

Article

Journal

Microelectronics reliability

Volume

54

Pages

1977-1981

No. of pages

5

ISSN

0026-2714

Publication date

01.09.2014

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/j.microrel.2014.07.039 (Access: Closed)