Publications of the Institute of Microelectronic Systems

Showing results 301 - 320 out of 585

2017


Two-LUT-Based Synthesizable Temperature Sensor for Virtex-6 FPGA Devices. / Nolting, Stephan; Liu, Lin; Payá-Vayá, Guillermo.
2017 27th International Conference on Field Programmable Logic and Applications (FPL). ed. / Diana Gohringer; Dirk Stroobandt; Nele Mentens; Marco Santambrogio; Jari Nurmi. Institute of Electrical and Electronics Engineers Inc., 2017. 8056805 (International Conference on Field-programmable Logic and Applications).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Improving the Processing Performance of a DSP for High Temperature Electronics using Circuit-Level Timing Speculation. / Payá Vayá, Guillermo; Roskamp, Steffen; Webering, Fritz et al.
2017. Tensilica Day 2017, Hannover, Germany.

Research output: Contribution to conferenceSlides to presentationResearch

Preface. / Payá Vayá, Guillermo; Blume, Holger.
Towards a Common Software/Hardware Methodology for Future Advanced Driver Assistance Systems: The DESERVE Approach. ed. / Guillermo Payá-Vayá; Holger Blume. River Publishers, 2017. p. xiii-xv (River Publishers Series in Transport Technology).

Research output: Chapter in book/report/conference proceedingForeword/postscriptResearchpeer review

Preface. / Payá Vayá, Guillermo; Blume, Holger.
Towards a Common Software/Hardware Methodology for Future Advanced Driver Assistance Systems: The DESERVE Approach. River Publishers, 2017. p. xiii-xv.

Research output: Chapter in book/report/conference proceedingForeword/postscriptResearchpeer review

Towards a common software/hardware methodology for future advanced driver assistance systems: The DESERVE approach. / Payá Vayá, Guillermo (Editor); Blume, Holger (Editor).
River Publishers, 2017. (River Publishers Series in Transport Technology).

Research output: Book/ReportMonographResearchpeer review

Small footprint synthesizable temperature sensor for FPGA devices. / Payá-Vayá, Guillermo; Bartels, Christopher; Blume, Holger.
In: Journal of Systems Architecture, Vol. 76, 10.04.2017, p. 28-38.

Research output: Contribution to journalArticleResearchpeer review

Performance estimation of indoor optical wireless communication systems using OMNeT++. / Pfefferkorn, Daniel; Helmholdt, Klemens; Blume, Holger.
2017 IEEE 22nd International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD). IEEE Computer Society, 2017.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Performance estimation of indoor optical wireless communication systems using OMNeT plus. / Pfefferkorn, Daniel; Helmholdt, Klemens; Blume, Holger.
In: IEEE International Workshop on Computer Aided Modeling and Design of Communication Links and Networks (CAMAD), 2017.

Research output: Contribution to journalArticleResearchpeer review

Differences in reliability effects for thick copper and thick aluminium metallizations. / Pohl, Martin; Erstling, Marco; Hein, Verena et al.
2017 International Reliability Physics Symposium, IRPS 2017. Institute of Electrical and Electronics Engineers Inc., 2017. p. MR2.1-MR2.7 7936377 (IEEE International Reliability Physics Symposium Proceedings).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Konzeptionierung und Implementierung einer hybriden MAC-Layer-Architektur für Paket-basierte Powerline Kommunikation auf einem FPGA. / Rother, Niklas.
2017. 83 p.

Research output: ThesisMaster's thesis

Real-time implementation of a GMM-based binaural localization algorithm on a VLIW-SIMD processor. / Seifert, Christopher; Thiemann, Joachim; Gerlach, Lukas et al.
2017 IEEE International Conference on Multimedia and Expo (ICME). IEEE Computer Society, 2017. p. 145-150 8019478.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks. / Sethu, Raj Sekar; Hein, Verena; Erstling, Marco et al.
2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7926226.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

An Integrated Heated Testbench for Characterizing High Temperature ICs. / Webering, Fritz; Payá Vayá, Guillermo; Aditya, Evan et al.
ICT.OPEN Proceedings 2017. 2017.

Research output: Chapter in book/report/conference proceedingConference contributionResearch

"Aufarbeitung ist nichts, was man einmal macht und dann abschließt": Interview zur Auseinandersetzung mit der NS-Zeit an der Leibniz Universität. / Wegener, Monika; Schröder, Anette; von Saldern, Adelheid et al.
In: Unimagazin: Forschungsmagazin der Leibniz Universität Hannover, Vol. 2017, No. 1, 2017, p. 4 - 7.

Research output: Contribution to specialist publicationContribution in popular science journalTransfer

COTS - Harsh condition effects considerations from technology to user level. / Weide-Zaage, Kirsten; Payá-Vayá, Guillermo.
In: Advances in Science, Technology and Engineering Systems, Vol. 2, No. 3, 2017, p. 1592-1598.

Research output: Contribution to journalArticleResearchpeer review

COTS-radiation effects approaches and considerations. / Weide-Zaage, Kirsten; Eichin, Philemon; Chen, Chen et al.
2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017. Institute of Electrical and Electronics Engineers Inc., 2017. 7859581 (2017 Pan Pacific Microelectronics Symposium, Pan Pacific 2017).

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review

Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation). / Weide-Zaage, Kirsten.
In: Microelectronics reliability, Vol. 76-77, 09.2017, p. 6-12.

Research output: Contribution to journalArticleResearchpeer review

Study of Corrosion in BGA solder balls. / Weide-Zaage, Kirsten; Fremont, Hélène; Guedon-Gracia, Alexandrine et al.
2017. Paper presented at Joint European Corrosion Congress 2017, EUROCORR 2017 and 20th International Corrosion Congress and Process Safety Congress 2017, Prague, Czech Republic.

Research output: Contribution to conferencePaperResearchpeer review

FLINT plus : A Runtime-Configurable Emulation-Based Stochastic Timing Analysis Framework. / Weissbrich, M.; Paya-Vaya, G.; Gerlach, L. et al.
In: International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS), 2017.

Research output: Contribution to journalArticleResearchpeer review

FLINT+: A Runtime-Configurable Emulation-Based Stochastic Timing Analysis Framework. / Weißbrich, Moritz; Payá-Vayá, Guillermo; Gerlach, Lukas et al.
2017 27th International Symposium on Power and Timing Modeling, Optimization and Simulation (PATMOS): Proceedings. Institute of Electrical and Electronics Engineers Inc., 2017. p. 1-8.

Research output: Chapter in book/report/conference proceedingConference contributionResearchpeer review