Publications of the Institute of Microelectronic Systems
Showing results 261 - 280 out of 592
2018
1. Auflage ed. Dr. Hut, 2018.
Research output: Thesis › Doctoral thesis
In: Frontiers in neurology, Vol. 9, 389, 06.2018.
Research output: Contribution to journal › Article › Research › peer review
2018. 384-386.
Research output: Contribution to conference › Paper › Research › peer review
In: Design & Elektronik: Know-How für Entwickler, Vol. 2018, 2018.
Research output: Contribution to journal › Article › Research
In: IEEE J. Solid State Circuits, Vol. 53, No. 12, 8474970, 2018, p. 3446-3454.
Research output: Contribution to journal › Article › Research › peer review
2018. Poster session presented at The International Conference on Biofabrication 2018, Würzburg, Germany.
Research output: Contribution to conference › Poster › Research › peer review
In: Journal of Communications, Vol. 13, No. 1, 2018, p. 1-7.
Research output: Contribution to journal › Article › Research › peer review
2018. 517-519.
Research output: Contribution to conference › Paper › Research › peer review
2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-6 (2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018; Vol. 2018-January).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2018 Pan Pacific Microelectronics Symposium, Pan Pacific 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-7.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-4.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2018.
Research output: Contribution to conference › Paper › Research
In: IEEE Journal of Solid-State Circuits, Vol. 53, No. 7, 07.2018, p. 1936-1944.
Research output: Contribution to journal › Article › Research › peer review
2017
Proceedings of the 8th International Symposium on Highly-Efficient Accelerators and Reconfigurable Technologies. Association for Computing Machinery (ACM), 2017. (ACM International Conference Proceeding Series).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2017 IEEE 31st International Parallel and Distributed Processing Symposium Workshops, IPDPSW 2017: Proceedings. IEEE Computer Society, 2017. p. 6-17.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Towards a Common Software/Hardware Methodology for Future Advanced Driver Assistance Systems: The DESERVE Approach. ed. / Guillermo Payá-Vayá; Holger Blume. River Publishers, 2017. p. 9-44 (Towards a Common Software/hardware Methodology for Future Advanced Driver Assistance Systems: the Deserve Approach).
Research output: Chapter in book/report/conference proceeding › Contribution to book/anthology › Research › peer review
2016 IEEE International Conference on Electronics, Circuits and Systems (ICECS). IEEE Computer Society, 2017. p. 392-395.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2017. Tensilica Day 2017, Hannover, Germany.
Research output: Contribution to conference › Slides to presentation › Research
Deutsches Patent- und Markenamt (DPMA). Patent No.: DE102015114514. Mar 02, 2017.
Research output: Patent
In: River Publishers Series in Transport Technology, 2017.
Research output: Contribution to journal › Article › Research › peer review
