Publications of the Institute of Microelectronic Systems
Showing results 201 - 220 out of 585
2019
2019.
Research output: Thesis › Doctoral thesis
Düren: Shaker Verlag, 2019. 172 p. (Berichte aus der Informationstechnik).
Research output: Book/Report › Monograph › Research › peer review
Hannover: Leibniz Universität Hannover, 2019. 172 p.
Research output: Thesis › Doctoral thesis
2019. Paper presented at International Workshop on Algorithms, Models and Tools for Parallel Computing on Heterogeneous Platforms, Göttingen, Germany.
Research output: Contribution to conference › Paper › Research
In: Journal of Systems Architecture, Vol. 97, 08.2019, p. 335-348.
Research output: Contribution to journal › Article › Research › peer review
Europäisches Patentamt (EPA). Patent No.: EP3441717A1. Feb 13, 2019.
Research output: Patent
14th International Symposium on Reconfigurable Communication-centric Systems-on-Chip (ReCoSoC 2019): Proceedings. ed. / William Fornaciari; David Novo; Leandro Soares Indrusiak. Institute of Electrical and Electronics Engineers Inc., 2019. p. 74-81 9034965 (International Symposium on Reconfigurable and Communication-Centric Systems-on-Chip (ReCoSoC)).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Hannover: Leibniz Universität Hannover, 2019. 176 p.
Research output: Thesis › Doctoral thesis
Patent No.: CN110620574A. Dec 27, 2019.
Research output: Patent
2019 IEEE Applied Power Electronics Conference and Exposition (APEC). Institute of Electrical and Electronics Engineers Inc., 2019. p. 2952-2956 8722002 (Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Hannover: Leibniz Universität Hannover, 2019. 202 p.
Research output: Thesis › Doctoral thesis
In: IEEE Solid-State Circuits Letters, Vol. 2, No. 11, 2019, p. 236-239.
Research output: Contribution to journal › Article › Research › peer review
2019 IEEE International Solid-State Circuits Conference, ISSCC 2019. IEEE, 2019. p. 156-158 8662491 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2019-February).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Assistive Technik für selbstbestimmtes Wohnen: 6. Ambient Medicine Forum. Göttingen: Cuvillier Verlag, 2019. p. 35-42 (Schriftenreihe Hochschule für Angewandte Wissenschaften Kempten; Vol. 6).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research
2019 IEEE 9th International Conference on Consumer Electronics (ICCE-Berlin): Proceedings. ed. / Gordan Velikic; Christian Gross. Institute of Electrical and Electronics Engineers Inc., 2019. p. 353-356.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
Embedded Computer Systems: Architectures, Modeling, and Simulation - 19th International Conference, SAMOS 2019, Proceedings. ed. / Dionisios N. Pnevmatikatos; Maxime Pelcat; Matthias Jung. Cham: Springer Verlag, 2019. p. 169-183 (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Vol. 11733 LNCS).
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724522.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2019 Pan Pacific Microelectronics Symposium, Pan Pacific 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8696273.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019: Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8724581.
Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review
In: Journal of Systems Architecture, Vol. 100, 101647, 07.11.2019.
Research output: Contribution to journal › Article › Research › peer review
