Institute of Microelectronic Systems

Publications Archive - IMS Database

Publications of the Institute of Microelectronic Systems

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Showing results 141 - 160 out of 592

2021

Markerless camera-based vertical jump height measurement using openpose. / Webering, Fritz; Blume, Holger; Allaham, Issam.
2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops, CVPRW 2021. IEEE Computer Society, 2021. p. 3863-3869 (2021 IEEE/CVF Conference on Computer Vision and Pattern Recognition Workshops (CVPRW)).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Measuring vertical jump height using a smartphone camera with simultaneous gravity-based calibration. / Webering, Fritz; Seeger, Leo; Rother, Niklas et al.
2021 IEEE International Conference on Consumer Electronics (ICCE). IEEE, 2021. 9427685 ( Proceedings of IEEE International Symposium on Consumer Electronics).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

2020

Modellierung von paralleler Software für homogene und heterogene Multiprozessor-Systeme. / Arndt, Oliver Jakob.
Hannover: Leibniz Universität Hannover, 2020. 155 p.

Research output: Thesis › Doctoral thesis

Multicore performance prediction with MPET: Using scalability characteristics for statistical cross-architecture prediction. / Arndt, Oliver Jakob; Lüders, Matthias; Riggers, Christoph et al.
In: Journal of Signal Processing Systems, Vol. 92, No. 9, 09.2020, p. 981-998.

Research output: Contribution to journal › Article › Research › peer review

Psychophysics Study on LED Flicker Artefacts for Automotive Digital Mirror Replacement Systems. / Behmann, Nicolai; Blume, Holger.
In: IS and T International Symposium on Electronic Imaging Science and Technology, Vol. 32, 234, 01.2020.

Research output: Contribution to journal › Conference article › Research › peer review

KAVUAKA: Chip Design für digitale Hörhilfen. / Blume, Holger Christoph; Payá Vayá, Guillermo; Gerlach, Lukas Konrad.
In: Unimagazin: Forschungsmagazin der Leibniz Universität Hannover, Vol. 2020, No. 1, 2020, p. 18-20.

Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer

SmartHeaP - Smart Hearing Aid Processor - Ein industrielles Translationsprojekt für digitale Hörhilfen. / Blume, Holger Christoph; Payá Vayá, Guillermo; Karrenbauer, Jens Christian et al.
In: Unimagazin: Forschungsmagazin der Leibniz Universität Hannover, 01.2020.

Research output: Contribution to specialist publication › Contribution in popular science journal › Transfer

Integrated Wide-Bandwidth Current Sensing. / Funk, Tobias; Wicht, Bernhard.
Springer, Cham, 2020.

Research output: Book/Report › Monograph › Research

Continuous-Flow Matrix Transposition Using Memories. / Garrido, Mario; Pirsch, Peter.
In: IEEE Transactions on Circuits and Systems I: Regular Papers, Vol. 67, No. 9, 9080548, 09.09.2020, p. 3035-3046.

Research output: Contribution to journal › Article › Research › peer review

Issue-Slot Based Predication Encoding Technique for VLIW Processors. / Gerlach, Lukas; Stuckmann, Fabian; Blume, Holger et al.
2020 9th International Conference on Modern Circuits and Systems Technologies: MOCAST 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9200304.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Evolutionary Algorithms for Instruction Scheduling, Operation Merging, and Register Allocation in VLIW Compilers. / Giesemann, F.; Gerlach, L.; Payá-Vayá, G.
In: Journal of Signal Processing Systems, Vol. 92, No. 7, 07.2020, p. 655-678.

Research output: Contribution to journal › Article › Research › peer review

Advances in Packaging for Emerging Technologies. / Hollstein, Kai; Weide-Zaage, Kirsten.
2020 Pan Pacific Microelectronics Symposium, Pan Pacific 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9059539.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Identification of influencing PCB design parameters on thermal performance of a QFN package. / Hollstein, Kai; Yang, Lintao; Gao, Yuan et al.
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9152651.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Silicon Die Bonding using a Photostructurable Adhesive Material. / Hollstein, Kai; Weide-Zaage, Kirsten.
2020 International Wafer Level Packaging Conference, IWLPC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9375868.

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Design Space Exploration Framework for Tensilica-Based Digital Audio Processors in Hearing Aids. / Karrenbauer, Jens; Gerlach, Lukas; Paya-Vaya, Guillermo et al.
2020 9th International Conference on Modern Circuits and Systems Technologies: MOCAST 2020. Institute of Electrical and Electronics Engineers Inc., 2020. 9200250 (2020 9th International Conference on Modern Circuits and Systems Technologies, MOCAST 2020).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

A Monolithic E-Mode GaN 15W 400V Offline Self-Supplied Hysteretic Buck Converter with 95.6% Efficiency. / Kaufmann, Maik; Lueders, Michael; Kaya, Cetin et al.
2020 IEEE International Solid-State Circuits Conference, ISSCC 2020. 2020. p. 288-290 9063102 (Digest of Technical Papers - IEEE International Solid-State Circuits Conference; Vol. 2020-February).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

A Monolithic GaN-IC With Integrated Control Loop for 400-V Offline Buck Operation Achieving 95.6% Peak Efficiency. / Kaufmann, Maik; Wicht, Bernhard.
In: IEEE J. Solid State Circuits, Vol. 55, No. 12, 9194294, 10.09.2020, p. 3169-3178.

Research output: Contribution to journal › Article › Research › peer review

Long, Short, Monolithic - The Gate Loop Challenge for GaN Drivers - Invited Paper. / Kaufmann, Maik; Seidel, Achim; Wicht, Bernhard.
Custom Integrated Circuits Conference (CICC) . 2020. p. 1-5 9075937 (Proceedings of the Custom Integrated Circuits Conference; Vol. 2020-March).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Establishing Reachset Conformance for the Formal Analysis of Analog Circuits. / Kochdumper, Niklas; Tarraf, Ahmad; Rechmal, Malgorzata et al.
2020 25th Asia and South Pacific Design Automation Conference (ASP-DAC). 2020. p. 199-204 9045120 (Proceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC; Vol. 2020-January).

Research output: Chapter in book/report/conference proceeding › Conference contribution › Research › peer review

Modeling of Reverse Current Effects in Trench–Based Smart Power Technologies. / Kollmitzer, Michael.
Hannover: Leibniz Universität Hannover, 2020. 150 p.

Research output: Thesis › Doctoral thesis

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