Electromigration effects in corroded BGA

verfasst von

Kirsten Weide-Zaage, Alexandrine Guedon-Gracia, Helene Fremont

Abstract

Most reliability or qualification tests focus on a single type of failure mechanism, whereas in the field, the devices are submitted to sequential and superimposed loads. In this paper, the influence on electromigration sensitivity due to corrosion of SAC solder joints is evaluated by finite element simulations. In comparison to new solder joints, the corroded zones induce a change in the weakest part location. Moreover, the maximum electromigration mass flux divergence of corroded bumps is approximately 35% higher than the normal solder bump, which means the electromigration performance is getting worse because of the corrosion. Moreover, the thermomigration effect is also worsened by the corrosion.

Organisationseinheit(en)

Institut für Mikroelektronische Systeme

Externe Organisation(en)

Universite de Bordeaux

Typ

Aufsatz in Konferenzband

Publikationsdatum

03.2019

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Fließ- und Transferprozesse von Flüssigkeiten, Elektrotechnik und Elektronik, Maschinenbau, Sicherheit, Risiko, Zuverlässigkeit und Qualität, Modellierung und Simulation

Elektronische Version(en)

https://doi.org/10.1109/eurosime.2019.8724522 (Zugang: Geschlossen)