Effect of thermal gradients on the electromigration life-time in power electronics

verfasst von

H. V. Nguyen, C. Salm, B. Krabbenborg, K. Weide-Zaage, J. Bisschop, A. J. Mouthaan, F. G. Kuper

Abstract

The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Externe Organisation(en)

University of Twente
NXP Semiconductors N.V.

Typ

Aufsatz in Konferenzband

Band

2004-January

Seiten

619-620

Anzahl der Seiten

2

Publikationsdatum

2004

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Ingenieurwesen (insg.)

Elektronische Version(en)

https://doi.org/10.1109/RELPHY.2004.1315418 (Zugang: Unbekannt)