Simulation of packaging under harsh environment conditions (temperature, pressure, corrosion and radiation)

verfasst von: Kirsten Weide-Zaage
Abstract: An important role of microelectronic packages is the protection of the chip against environmental influences like moisture, pollutants and other chemical active species. If the chip is exposed to these conditions, for instance corrosion is resulting. Furthermore, due to high temperature load and pressure or vibrations, the reliability of the package is influenced by thermo-mechanical stress. The unavoidable presence of particle radiation on ground and in the atmosphere leads to unwanted failures in the electronic devices, partly affected by the package material and solder. All these harsh conditions will happen more and more in the frame of automotive, medical and avionic applications. For space application all of these parameters are important as well. Due to this, an essential aspect of the package design is the careful combination of materials to avoid mechanical stress and to improve the thermal-electrical and mechanical behavior as well as the corrosion resistance and radiation hardness of the package. Simulation analysis can give, using the appropriate software, depending on the material properties, the package geometry as well as the boundaries, a fast and reliable solution to investigate the influence of mechanical stress as well as the thermal, electrical and mechanical behavior of the package.
Organisationseinheit(en): Institut für Mikroelektronische Systeme
Typ: Artikel
Journal: Microelectronics reliability
Band: 76-77
Seiten: 6-12
Anzahl der Seiten: 7
ISSN: 0026-2714
Publikationsdatum: 09.2017
Publikationsstatus: Veröffentlicht
Peer-reviewed: Ja
ASJC Scopus Sachgebiete: Elektronische, optische und magnetische Materialien, Atom- und Molekularphysik sowie Optik, Sicherheit, Risiko, Zuverlässigkeit und Qualität, Physik der kondensierten Materie, Oberflächen, Beschichtungen und Folien, Elektrotechnik und Elektronik
Elektronische Version(en): https://doi.org/10.1016/j.microrel.2017.07.026 (Zugang: Geschlossen)