Mechanical characterization of copper based metallizations with different via-bottom geometries

verfasst von

Johar Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel

Abstract

The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Externe Organisation(en)

Global Foundries, Inc.

Typ

Aufsatz in Konferenzband

Publikationsdatum

2010

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1109/IPFA.2010.5532227 (Zugang: Unbekannt)