Characterization of a new designed octahedron slotted metal track by simulations

verfasst von

Jörg Kludt, K. Weide-Zaage, M. Ackermann, V. Hein

Abstract

Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as 'power metals' are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for 'power metals' was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Externe Organisation(en)

X-FAB Silicon Foundries SE

Typ

Aufsatz in Konferenzband

Publikationsdatum

2013

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektrotechnik und Elektronik, Modellierung und Simulation

Elektronische Version(en)

https://doi.org/10.1109/EuroSimE.2013.6529907 (Zugang: Unbekannt)