Investigations of mechanical stress and electromigration in an aluminum meander structure

verfasst von

Xiaoying Yu, Kirsten Weide

Abstract

For reliability prediction in metallization structures the different migration mechanisms like electro-thermo- and stressmigration (due to mismatch of thermal expansion and elastic moduli) become more and more important. With numerical methods like the finite element methode FEM, it is possible to determine the weakest part of a metallization structure. In this paper the mechanical stress distribution as well as the mass flux and mass flux divergence due to electrical, mechanical and thermal effects will be investigated and correlated with measurements. In the investigations an unpassivated aluminum-meander test structure was used. For the aluminum meander structure the current density, temperature gradients and mechanical stress distributions were determined by finite element simulations with the FEM-program ANSYS. The resistivity as well as the activation energy was determined by measurements. Based on the results of the simulations the mass flux due to mechanical stress were calculated and compared with the calculated electro- and therrnomigration mass flux.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Typ

Aufsatz in Konferenzband

Seiten

160-166

Anzahl der Seiten

7

Publikationsdatum

11.09.1997

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Elektronische, optische und magnetische Materialien, Physik der kondensierten Materie, Angewandte Informatik, Angewandte Mathematik, Elektrotechnik und Elektronik

Elektronische Version(en)

https://doi.org/10.1117/12.284698 (Zugang: Geschlossen)