Finite element analysis of thermal-mechanical stress induced failure in interconnects

verfasst von

X. Yu, K. Weide

Abstract

In this work a study of the nature as well as an evaluation of the thermal-mechanical stress in aluminum interconnects was carried out. A theoretical model describes the atom flux which can be induced by the relaxation of the stress. Based on this theory an algorithm has been developed and integrated into the finite element simulation software. This algorithm allows the calculation of the mass flux divergence and prediction of the failure location before the damage occurs. For the verification of this algorithm an aluminum pad structure sputtered on thermal oxide layer was used. The failure location was correlated with in situ observation during the long term stress tests. Experimental results confirm that the observed structure degradations correspond with the simulations very well.

Organisationseinheit(en)

Laboratorium f. Informationstechnologie

Typ

Konferenzaufsatz in Fachzeitschrift

Journal

Materials Research Society Symposium - Proceedings

Band

539

Seiten

269-274

Anzahl der Seiten

6

ISSN

0272-9172

Publikationsdatum

1999

Publikationsstatus

Veröffentlicht

Peer-reviewed

Ja

ASJC Scopus Sachgebiete

Allgemeine Materialwissenschaften, Physik der kondensierten Materie, Werkstoffmechanik, Maschinenbau