How to study delamination in plastic encapsulated devices

authored by

Hélène Frémont, Jean Yves Delétage, Kirsten Weide-Zaage, Yves Danto

Abstract

Delaminations are a major concern in plastic encapsulated devices (PED). This paper presents three complementary methods to evaluate the sensitivity of PED to this problem. Analytical models are fast to implement, and permit to derive a comparative evaluation between different packages. To refine the results, finite element models, necessitating longer calculation times are very useful, but need to be validated by real measurements, which can be done with assembly test chips.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

Centre national de la recherche scientifique (CNRS)

Type

Article

Journal

Microelectronics reliability

Volume

44

Pages

1311-1316

No. of pages

6

ISSN

0026-2714

Publication date

09.2004

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/j.microrel.2004.07.015 (Access: Unknown)