Effect of thermal gradients on the electromigration life-time in power electronics

authored by

H. V. Nguyen, C. Salm, B. Krabbenborg, K. Weide-Zaage, J. Bisschop, A. J. Mouthaan, F. G. Kuper

Abstract

The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

University of Twente
NXP Semiconductors N.V.

Type

Conference contribution

Volume

2004-January

Pages

619-620

No. of pages

2

Publication date

2004

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Engineering(all)

Electronic version(s)

https://doi.org/10.1109/RELPHY.2004.1315418 (Access: Unknown)