Mechanical characterization of copper based metallizations with different via-bottom geometries

authored by

Johar Ciptokusumo, Kirsten Weide-Zaage, Oliver Aubel

Abstract

The influence of the via bottom geometry on stress development in Cu interconnects is investigated by FE-Simulation. The mechanical characterization shows the weakest link concerning the reliability of the different via geometries. The via with the cone-shaped bottom seems to have the best reliability with respect to mechanical stress.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

Global Foundries, Inc.

Type

Conference contribution

Publication date

2010

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1109/IPFA.2010.5532227 (Access: Unknown)