Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers

authored by

L. Meinshausen, H. Frémont, K. Weide-Zaage

Abstract

Because of material movements intermetallic compound layers are formed between metal layers and solder joints. These intermetallics affect the reliability of the solder joints by reducing their lifetime during drop test or by accelerating the migration induced void formation. This study investigates the migration kinetics of Cu, Ni, Au and Sn in SAC305 solder joints on three different metal layers: Cu, NiAu and NiP. The aim of this study is the identification and description of migration processes during aging of solder joints with one and double sided Ni diffusion barriers.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

Universite de Bordeaux

Type

Article

Journal

Microelectronics reliability

Volume

52

Pages

1827-1832

No. of pages

6

ISSN

0026-2714

Publication date

09.2012

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Condensed Matter Physics, Safety, Risk, Reliability and Quality, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/j.microrel.2012.06.127 (Access: Unknown)