Moisture diffusion in printed circuit boards

Measurements and finite- element- simulations

authored by

Kirsten Weide-Zaage, Walter Horaud, Hélène Frémont

Abstract

When printed circuit boards (PCBs) are exposed to humid ambient conditions an absorption of moisture will occur. This infects the reliability of the PCB and also delamination can occur during reflow. Copper layers in the PCB act as diffusion barrier and have an influence of the moisture distribution and out of this an influence on the moisture concentration in the PCB. Depending on the location the time to get dry PCB increases. In this paper the measurement of different PCB samples will be compared with concentration distribution out of simulations.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

Solectron
IXL Laboratory

Type

Article

Journal

Microelectronics reliability

Volume

45

Pages

1662-1667

No. of pages

6

ISSN

0026-2714

Publication date

09.2005

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Condensed Matter Physics, Safety, Risk, Reliability and Quality, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/j.microrel.2005.07.077 (Access: Unknown)