Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps
- authored by
- L. Meinshausen, K. Weide-Zaage, H. Frémont
- Abstract
Microbumps consisting of intermetallic compounds like Cu6Sn 5 or Cu3Sn have a longer lifetime during electromigration tests than SnAgCu microbumps. To explain the difference in behavior of Cu-Sn IMCs and SnAgCu during stress test the migration induced mass flux was calculated for Cu3Sn and Cu6Sn5. The results were compared to the mass flux in SnAgCu 305. Furthermore average effective charge values for Cu3Sn and Cu6Sn5 were approximated by comparing the separated movement of Cu and Sn with three different models for an averaged mass flux in the IMCs.
- Organisation(s)
-
Laboratorium f. Informationstechnologie
- External Organisation(s)
-
Universite de Bordeaux
- Type
- Article
- Journal
- Microelectronics reliability
- Volume
- 51
- Pages
- 1860-1864
- No. of pages
- 5
- ISSN
- 0026-2714
- Publication date
- 09.2011
- Publication status
- Published
- Peer reviewed
- Yes
- ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering
- Electronic version(s)
-
https://doi.org/10.1016/j.microrel.2011.06.032 (Access:
Unknown)
