A study of the thermal - electrical- and mechanical influence on degradation in an aluminum - pad structure

authored by

X. Yu, K. Weide

Abstract

For an aluminum-pad test structure the distributions of current density, temperature gradients and mechanical stress were determined by FEM simulations. Based on this results the electro-, thermo- and the stressmigration were calculated. The failure location out of the maximum mass flux divergence was correlated with the reliability characterization of in situ observation in SEM. A very good agreement between measurement and simulation was found.

Organisation(s)

Laboratorium f. Informationstechnologie

Type

Article

Journal

Microelectronics reliability

Volume

37

Pages

1545-1548

No. of pages

4

ISSN

0026-2714

Publication date

1997

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Safety, Risk, Reliability and Quality, Condensed Matter Physics, Surfaces, Coatings and Films, Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1016/S0026-2714(97)00105-4 (Access: Unknown)