A design for highly robust ALCU-W-PLUG-metallization stack

authored by: V. Hein, M. Ackermann, M. Erstling, J. Liew, K. Weide-Zaage
Abstract: Mission profiles for semiconductor applications are getting more and more challenging regarding electrical and thermo-mechanical robustness of metallization stacks. Effects, especially in thick metals, were investigated over the last years to find solutions for an improvement regarding both potential stressors. Some elements of a metallization were designed, investigated and simulated [1, 2, 3, 4 5]. But for an implementation in products it is necessary to develop a complete metallization stack. Therefore a support for layout tools is indispensable. This paper will explain the principles of a highly robust AlCu-metallization stack, the physics and failure mechanisms which are considered for some elements of such a metal stack and the design solution.
Organisation(s): Institute of Microelectronic Systems
External Organisation(s): X-FAB Silicon Foundries SE
Type: Conference contribution
Publication date: 07.03.2016
Publication status: Published
Peer reviewed: Yes
ASJC Scopus subject areas: Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials
Electronic version(s): https://doi.org/10.1109/panpacific.2016.7428423 (Access: Closed)