Effect of thermal gradients on the electromigration lifetime in power electronics

authored by

H. V. Nguyen, C. Salm, B. Krabbenborg, K. Weide-Zaage, J. Bisschop, A. J. Mouthaan, F. G. Kuper

Abstract

The combined effects of electromigration and thermomigration are studied. Significantly shorter electromigration lifetimes are observed in the presence of a temperature gradient. This cannot be explained by thermomigration only, but is attributed to the effect of temperature gradient on electromigration-induced failures.

Organisation(s)

Laboratorium f. Informationstechnologie

External Organisation(s)

University of Twente
NXP Semiconductors N.V.

Type

Conference contribution

Pages

619-620

No. of pages

2

Publication date

2004

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering, Safety, Risk, Reliability and Quality