Introduction to the Special Issue on the 2019 IEEE International Solid-State Circuits Conference (ISSCC)

authored by

Youngcheol Chae, Bernhard Wicht, Bob Verbruggen, Payam Heydari, Howard Luong

Abstract

This special Issue of the IEEE Journal of Solid-State Circuits is dedicated to a collection of the best articles selected from the 2019 IEEE International Solid-State Circuits Conference (ISSCC) that took place on February 17–21, 2019, in San Francisco, CA, USA. This issue covers articles from the Analog, Power Management, Data Converters, RF, and Wireless Committees

Organisation(s)

Mixed-Signal Circuits Section

External Organisation(s)

Yonsei University
AMD XILINX
University of California at Irvine
Hong Kong University of Science and Technology

Type

Article

Journal

IEEE J. Solid State Circuits

Volume

54

Pages

3243-3246

No. of pages

4

Publication date

22.11.2019

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering

Electronic version(s)

https://doi.org/10.1109/JSSC.2019.2946496 (Access: Closed)