Simulation of needle bumps in a package-on-package structure

authored by

Kirsten Weide-Zaage, Peiyu Xu

Abstract

In the frame of ULSI under the requirement of higher integration, cost reduction and lower power consumption of the electronic device new package technologies become more and more of interest. Package-on-Package (PoP) is one of the interesting technologies. Normally PoP Packages consist of BGA SAC bumps. The use of needle bumps, consisting of Cooper was introduced by INVENSAS. This technology was developed for the use under high I/O rates. During high I/O rates Joule heating may occur. Furthermore supported due to the self-heating effect migration effects in the solder material can occur. The thermal-electrical calculation followed by the calculation of migration effects in needle bumps will be presented in this paper. The results will be compared with BGA bumps. Also the influence of the growth of intermetallic compounds will be discussed.

Organisation(s)

Institute of Microelectronic Systems

Type

Conference contribution

Publication date

2016

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Electrical and Electronic Engineering, Engineering (miscellaneous), Electronic, Optical and Magnetic Materials