3-D time-depending electro- and thermomigration simulation of metallization structures

authored by

D. Dalleau, K. Weide-Zaage

Abstract

For reliability prediction in metallization structures the different migration mechanisms caused by high loading conditions become more and more important. With numerical methods like the finite element method (FEM), it is possible to determine the weakest part of the structure. This paper presents a new method for time dependent 3-dimensional degradation simulations of metallization structures stressed by high current densities. The FE-method offers the possibility to predict the progress of the degradation, and to estimate the reliability by calculating the corresponding Time To Failure (TTF) value. The simulation results are in good agreement with SEM observations and measurements.

Organisation(s)

Laboratorium f. Informationstechnologie

Type

Conference article

Journal

Advanced Metallization Conference (AMC)

Pages

477-481

No. of pages

5

ISSN

1048-0854

Publication date

2000

Publication status

Published

Peer reviewed

Yes

ASJC Scopus subject areas

Chemical Engineering(all)