Showing results 101 - 107 out of 107
Yu X, Weide K. Finite element analysis of thermal-mechanical stress induced failure in interconnects. Materials Research Society Symposium - Proceedings. 1999;539:269-274.
Weide K, Keck C, Yu X. Influence of the material properties on the thermal behaviour of a package. In Microelectronic manufacturing, yield, reliability, and failure analysis IV: 23 - 24 September 1998, Santa Clara, California. Bellingham: SPIE. 1998. p. 112-121. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.324388
Yu X, Weide K. A study of the thermal - electrical- and mechanical influence on degradation in an aluminum - pad structure. Microelectronics reliability. 1997;37(10-11):1545-1548. doi: 10.1016/S0026-2714(97)00105-4
Yu X, Weide K. Investigations of mechanical stress and electromigration in an aluminum meander structure. In Microelectronic Manufacturing Yield, Reliability, and Failure Analysis III: 1 - 2 October 1997, Austin, Texas. Bellingham: SPIE. 1997. p. 160-166. (Proceedings of SPIE - The International Society for Optical Engineering). doi: 10.1117/12.284698
Weide K, Yu X, Menhorn F. Finite element investigations of mechanical stress in metallization structures. Microelectronics reliability. 1996;36(11-12 SPEC. ISS.):1703-1706. doi: 10.1016/0026-2714(96)00178-3
Weide K, Ullmann J, Hasse W. Model calculations on a bipolar transistor emitter interconnection with different contact shapes. Applied surface science. 1995 Oct 2;91(1-4):234-238. doi: 10.1016/0169-4332(95)00124-7
Weide K, Hasse W. 3-dimensional simulations of temperature and current density distribution in a via structure. In Annual Proceedings - Reliability Physics (Symposium). Publ by IEEE. 1992. p. 361-365. (Annual Proceedings - Reliability Physics (Symposium)). doi: 10.1109/relphy.1992.187670
